The optical communications industry is entering a more consequential stage of the AI infrastructure build-out, with bandwidth requirements rising rapidly while power consumption, thermal density and physical space are equally challenging constraints. This is setting the stage for industry events that highlight what infrastructure providers are doing to address the challenges. With that in mind, the ECOC Exhibition and Conference 2026 is set to take place in Málaga, Spain later this month. The event is one of Europe’s principal gatherings for optical communications, bringing together component manufacturers, transceiver suppliers, network equipment vendors, photonics specialists, and fiber infrastructure companies.
ECOC’s Market Focus program this year includes dedicated discussions on 1.6T connectivity, post-1.6T architectures, co-packaged optics, near-packaged optics, optical circuit switching, high-density connectivity and the physical infrastructure required for AI data centers. The program also brings together hyperscalers, network equipment manufacturers and optical component suppliers, providing an insightful view into the optical networking ecosystem. Like many shows, the challenge is discerning which technology stacks are moving from technical development towards commercial deployment and the resulting value. Ahead of ECOC, here are my ten companies to watch.
Avicena
Avicena offers an interesting perspective about the potential disruption in short-reach optical interconnects. The company is exhibiting its LightBundle microLED technology at ECOC this year, targeting AI infrastructure and chip-to-chip communications.
My Point of View: Avicena claims its technology is designed to deliver bandwidth at less than 1 pJ/bit, and it launched an optical interconnect evaluation platform earlier this year. The company is pursuing a different approach to short-reach optical connectivity and I believe it could emerge as a disruptive force if it can translate its power-efficiency advantage into scalable, production-ready deployments.
Ciena
Ciena is planning to showcase its Vesta 200 6.4T CPX optical engine at ECOC. The solution is designed around the Open CPX MSA, which aims to establish a standardized architecture for scalable CPO and CPC adoption.
My Point of View: Ciena is demonstrating the power of the convergence of optical networking and AI infrastructure
Cisco
Cisco provides a system-level capability tied to driving critical improvements in optical networking, including coherent optics, network management, and the evolution of Ethernet for AI. Its plans at ECOC this year includes demonstrating progress in CMIS for coherent pluggables, supported by Cisco executives participating in discussions about the future of Ethernet in AI infrastructure.
My Point of View: Component innovation must translate into deployable network architectures. Cisco balances the needs of massive AI fabrics, optical integration, and traditional pluggables with its proven success in both service provider and enterprise network deployments.
Coherent
Coherent offers one of the broadest optical technology portfolios spanning lasers, optical components, transceivers, coherent technology, and fiber, providing it with many opportunities to capitalize on the AI supercycle.
My Point of View: Coherent’s broad optical portfolio positions it to capture AI infrastructure spending across multiple layers of the data center stack, reducing reliance on any sole product category.
Credo Technology
Credo focuses on the power and signal-integrity challenges brought on by faster AI fabrics. The company prioritizes power efficiency, latency, and diagnostics in its Cardinal 1.6T optical DSP series, which supports retimed 1.6T optics and LRO implementations.
My Point of View: Credo is well positioned to benefit from the shift toward 1.6T AI networking, where power efficiency and signal integrity are becoming critical constraints, giving its DSP technology a clear path to gain share as AI fabrics scale.
Jabil
Jabil is showcasing a 1.6T DR8 LRO optical transceiver at ECOC this year and is also participating in meaningful discussions centered on photonics packaging for high-volume manufacturing.
My Point of View: The transition to higher-speed optics increases complexity of scaling optical networking infrastructure, balancing packaging, thermal management, and production testing. If Jabil can execute, it can facilitate needed simplification of supply chain management. The jury is still out whether advanced photonics packaging can become a meaningful source of incremental revenue and margin. The opportunity tied to improving manufacturing capacity could become a competitive differentiator for Jabil as 1.6T and future higher throughput moves into broader deployment.
Lumentum
Lumentum is participating in ECOC’s AI interconnect program this year and has two nominations in the Optical Component Innovation Award category for its DWDM UHP Laser and 400G PAM4 Differential Drive EML. It is also worth highlighting that its portfolio also includes a VCSEL-based optical engine targeting AI scale-up networks.
My Point of View: Lumentum provides crucial lasers and photonic components underpinning higher-speed optical connectivity. It highlights Lumentum’s capability in enabling the higher-speed optical infrastructure required for AI data centers.
Marvell
Marvell is delivering its COLORZ 1600 1.6T ZR/ZR+ coherent technology, including next-generation pluggable optics and scale-across architectures, to ECOC, along with its 1.6T Optical DSP portfolio.
My Point of View: DSP complexity will continue to increase as data rates rise, and alternative architectures eventually reduce the DSP processing required. With growing 1.6T adoption, hyperscaler demand, and the balance between conventional pluggable optics, LPO/LRO, more integrated architectures are required.
NewPhotonics
NewPhotonics offers an interesting take on one of the most controversial architectural debates at ECOC this year – whether near-packaged optics can provide a practical bridge between conventional pluggables and fully integrated CPO. The company will highlight its NPC505 near-packaged optics portfolio and a 1.6T NPO laser-integrated transmitter. Its ECOC demonstration program also includes a 1.6T DR8 OSFP module, a 1.6T LPO+ module, and additional NPO and CPO developments.
My Point of View: NPO could become an important consideration as data-center operators continue to demand higher optical density and lower power consumption in lieu of the complexity of full CPO deployment. Commercial traction is key and proof will lie in successful customer engagement, design wins, and progress towards production volume.
OpenLight Photonics
OpenLight is one of the more interesting solution providers attending ECOC this year. Its 1.6T DR8 silicon photonics PIC for LRO and LPO applications are nominated for the Optical Component Innovation Award.
My Point of View: The company’s technology addresses a core challenge tied to next-generation optical connectivity. Higher bandwidth requires greater integration of optical functionality while managing the complexity of power consumption and packaging. OpenLight’s approach combines silicon photonics with integrated active optical components, creating a pathway towards higher-density optical engines.
My Expectations For Europe’s Most Significant Optical Networking Event
I will be attending ECOC this year, and I have a handful of expectations. First, the extent of 1.6T activity spanning DSPs, optical modules, PICs, testing, and packaging is a strong indication that the optical networking industry is getting closer to a major commercial turning point. 1.6T is quickly materializing as a table stakes requirement to support the enormous data volume that is expected to crest with AI infrastructure deployments
Second, an architectural change is required to support a continued build out of massive AI clustering. Traditional pluggables will still be utilized, but LPO and LRO have great promise in reducing complexity and power. NPO and CPO bring optical functionality closer to the switching silicon and reduce electrical processing requirements, and I expect that ECOC 2026 will provide meaningful insights into actual customer adoption versus vendor claims and marketing positioning.
Finally, higher bandwidth requirements will increase the importance of DSPs, lasers, modulators, PICs, optical engines, packaging, and manufacturing. The big question is whether the supply chain can scale to keep pace through higher manufacturing yields, advancements in packaging and thermal management, and testing capability to validate performance and deployment viability. Consequently, ECOC 2026 should offer practical perspectives into how the optical industry intends to support the next phase of the AI supercycle.
